Researching | Electronics and Packaging

Electronics and Packaging

CN

32-1709/TN

ISSN

1681-1070

Frequency

Monthly issues

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Research Progress of Glass-Based Bonding Technology

Electronics and PackagingVol. 25, Issue 7, 70102 (2025)

Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures

Electronics and PackagingVol. 25, Issue 7, 70103 (2025)

Research Status of Through Glass Via Technology and Its Reliability

Electronics and PackagingVol. 25, Issue 7, 70106 (2025)

CBGA Solder Joint Life Prediction Technology Based on Test and Simulation

Electronics and PackagingVol. 25, Issue 7, 70201 (2025)

Method and Simulation Analysis of Inorganic Buffer Layer for Reducing TGV Stress in Glass Substrate

Electronics and PackagingVol. 25, Issue 7, 70108 (2025)

Application of Glass Substrates in Co-Packaged Optics Technology

Electronics and PackagingVol. 25, Issue 7, 70105 (2025)