Electronics and Packaging
CN
32-1709/TN
ISSN
1681-1070
Frequency
Monthly issues
Aug. 26, 2025Electronics and Packaging
DOI:
[in Chinese]
CAI Mao, XU Yong, HONG Yu, and MAO Zhonghu
Aug. 26, 2025Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0154
Research on BGA Solder Ball Isolation Performance in 3D SiP Module
LI Jie, CAO Shibo, YU Wei, LI Zeyuan, QIAO Zhizhuang, LIU Linjie, ZHANG Zhaofu, LIU Sheng, and GUO Yuzheng
Aug. 26, 2025Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0153
CBGA Solder Joint Life Prediction Technology Based on Test and Simulation
ZHAO Jin, YU Daquan, and QIN Fei
Aug. 26, 2025Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0161
Research Progress of Glass Substrate Technology
MA Xiaohan, DONG Ruipeng, WAN Xin, JIA Fengrui, and LONG Xu
Aug. 26, 2025Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0160
Mechanical Reliability Issues and Research Progress of Through Glass Via Technology