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Electronics and Packaging
CN
32-1709/TN
ISSN
1681-1070
Frequency
Monthly issues
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[in Chinese]
Aug. 26, 2025
Electronics and Packaging
DOI:
Research on BGA Solder Ball Isolation Performance in 3D SiP Module
CAI Mao, XU Yong, HONG Yu, and MAO Zhonghu
Aug. 26, 2025
Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0154
CBGA Solder Joint Life Prediction Technology Based on Test and Simulation
LI Jie, CAO Shibo, YU Wei, LI Zeyuan, QIAO Zhizhuang, LIU Linjie, ZHANG Zhaofu, LIU Sheng, and GUO Yuzheng
Aug. 26, 2025
Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0153
Research Progress of Glass Substrate Technology
ZHAO Jin, YU Daquan, and QIN Fei
Aug. 26, 2025
Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0161
Mechanical Reliability Issues and Research Progress of Through Glass Via Technology
MA Xiaohan, DONG Ruipeng, WAN Xin, JIA Fengrui, and LONG Xu
Aug. 26, 2025
Electronics and Packaging
DOI:10.16257/j.cnki.1681-1070.2025.0160
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Research Status of Through Glass Via Technology and Its Reliability
Electronics and Packaging
Vol. 25, Issue 7, 70106 (2025)
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CBGA Solder Joint Life Prediction Technology Based on Test and Simulation
Electronics and Packaging
Vol. 25, Issue 7, 70201 (2025)
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Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures
Electronics and Packaging
Vol. 25, Issue 7, 70103 (2025)
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Method and Simulation Analysis of Inorganic Buffer Layer for Reducing TGV Stress in Glass Substrate
Electronics and Packaging
Vol. 25, Issue 7, 70108 (2025)
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Application of Glass Substrates in Co-Packaged Optics Technology
Electronics and Packaging
Vol. 25, Issue 7, 70105 (2025)
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Research Progress of Glass-Based Bonding Technology
Electronics and Packaging
Vol. 25, Issue 7, 70102 (2025)
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