With the continuous development of 3D integration technology, glass-based packaging has begun to be widely researched due to its unique advantages. Bonding technology, as the key and a major challenge of glass-based packaging, is the direct core of constructing “chip skyscrapers”. It must simultaneously meet stringent requirements for physical connection strength, electrical reliability, and thermal compatibility of heterogeneous materials. Based on whether global heating is required, bonding technologies can be categorized into two groups: thermal bonding, represented by thermocompression diffusion bonding and anodic bonding, and room-temperature bonding, represented by ultrahigh-vacuum surface-activated bonding and laser bonding. Surface treatment technologies, including low-vacuum plasma activation, vacuum ultraviolet irradiation activation, and wet-chemical activation, are highly effective in reducing bonding temperature and enhancing bonding success rate. Through a review of the technical principles and characteristics of glass-based bonding technologies, their advantages and disadvantages in diverse application scenarios are evaluated, providing references and ideas for the continuous innovation and development of glass-based bonding technology.