Ceramic ball grid array (CBGA) packaging technology plays a crucial role in the field of electronic packaging due to its high-density interconnect advantages, and the reliability of solder joints is a key factor affecting device performance. The finite element method is used to investigate the life prediction technology of solder joints under thermal cycling loads. Monitor the on resistance through board level temperature cycling test to analyze the lifes data of solder joints. A finite element model of CBGA solder joints is constructed, and simulation and experimental data are compared and analyzed. The average increment of solder joint strain energy density is determined as the life characterization factor, and the robustness of the model is optimized. The experimental measured data is organically combined with simulation results and integrated into the Darveaux life model, the solder joint life prediction method is established. The research results confirm that this method can effectively predict the life of CBGA solder joints, providing strong technical support for the reliability design of similar packaged products.