Through glass via (TGV) technology, as a key technology for three-dimensional integration and advanced packaging, demonstrates broad application prospects in radio frequency devices, high-density heterogeneous integration devices, and optoelectronic co-packaged devices, owing to its excellent high-frequency performance, low dielectric loss, and superior thermomechanical stability. However, reliability issues with TGV technology remain one of the core challenges hindering the large-scale industrialization. The development history of TGV technology, its current application research status, the fabrication processes of glass interposers, and recent advancements in reliability studies are systematically reviewed. The reliability problems of key TGV interconnect structures caused by processing, design, and thermal stress are particularly discussed. After summarizing common interconnect failure mechanisms, the current shortcomings are highlighted in TGV reliability research, including studies on multi-field coupled failures, collaborative evaluation of multiple performance parameters, and the development of failure analysis methods. In response to the demand for developing next-generation high-performance devices based on TGV technology, key areas requiring further attention in future reliability research are analyzed. Insights and references for subsequent systematic reliability studies on glass interposers and TGV technology are provided.