In order to solve the technical problems that the refraction optical system is not easy to achieve the long focal length miniaturization design and the reflection optical system is not easy to achieve the large field of view, the shortwave infrared imaging optical system with the focal length of 500 mm, the operating band of 09－17 m and F number of 5 is designed by using an optical structure with the form of refraction and reflection. The system consists of a parabolic primary mirror, a quadric secondary mirror and a rear set of lenses, with a total optical length of 138 mm. The design results show that the system has a compact structure, small size and good imaging quality. The value of modulation transfer function (MTF) at the characteristic frequency of 33 1p/mm corresponding to the detector is greater than 055, which is close to the diffraction limit. MTF test and location imaging test are carried out after the assembly of the whole machine. The actual test results are consistent with the design analysis and meet the application requirements.

With the continuous development of mercury cadmium telluride (MCT) materials and device technology, ultra-large array scale infrared detectors that meet the requirements of a large field-of-view and ultra-high resolution applications are gradually being put into engineering applications. The low-temperature reliability of ultra-large array detector chips has become a key research topic in packaging technology. Taking a certain ultra-large area array HgCdTe hybrid chip as the research object, the finite element simulation analysis method was used to study the influence of factors such as cold head material system, cold head outer diameter, and cold stage structural form on the low-temperature stress and deformation of the chip photosensitive surface of the hybrid chip. Finally, a set of cold head structures and material systems that can meet the low-temperature reliability requirements of the super large area array chips was designed and optimized. The simulation results show that the maximum stress of the silicon circuit in the cold head system at low temperature is about 70 MPa, and the deformation of the mercury cadmium telluride photosensitive region at low temperature is about 30 m. The simulation results can meet the empirical simulation threshold for engineering application reliability requirements, effectively improving the highly reliability and miniaturized packaging technology of the ultra-large area array infrared detectors.

Dewar provides a good low-temperature working environment and light, mechanical, electrical, and thermal transmission channels for infrared focal plane detectors. The cold table support structure serves as the bearing platform of the infrared detector, bearing the effects of equipment transportation, vibration, impact, etc., which puts higher requirements on the strength of the support structure. Therefore, it is necessary to develop new support structures to improve the reliability of dewar. Based on the demand for low conduction heat leakage and high reliability of infrared detector components, different support structure materials were analyzed from both macroscopic and microscopic perspectives, and the influence of support structures prepared by two molding processes on the design and manufacturing of infrared detectors was compared. Compared with traditional processing methods, the accuracy of zirconia formed by digital light processing (DLP) technology can reach ±003 mm, which is consistent with the standard card of XRD diffraction peak. This indicates that its purity is high, and this technology can shorten the processing time and optimize the packaging process.

Infrared large-area array (2560×2048) digital readout circuits require high-speed, low-power consumption , and strong driving capabilities for chip data interfaces. Using 018 m complementary metal oxide semiconductor (CMOS) process, a 4∶1 parallel-to-serial conversion circuit, a level translation circuit, and a low voltage differential signal (LVDS) driver circuit using pre-emphasis technology were designed. The parallel-to-serial conversion circuit adopts a double-edge sampling tree structure to reduce clock frequency, the level translation circuit adopts a positive feedback structure to improve the speed, and the LVDS driving circuit uses a pre-emphasis secondary path with programmable current to compensate for high-frequency components in the main path, ensuring driving capability and improving the integrity of high-speed signals. The data transmission rate of the interface can reach 1 Gbit/s, and when the load capacitance is 2 pF, the power consumption of one channel is 158 mW@1 Gbit/s; When the load capacitance is 8 pF, with pre-emphasis turned on, the power consumption of one channel is 19 mW@1 Gbit/s, the output voltage swing is 350 mV, and the output common-mode level is 121 V. All parameters of the LVDS drive circuit meet the standard protocol.

The Lunar Orbiter Laser Altimeter (LOLA) is currently the largest and most accurate laser altimeter in lunar exploration, which can provide geographical control for other lunar products. However, due to the uncertainty of orbit determination and laser direction deviation, there are geographic positioning errors on some laser profiles. In view of these abnormal orbit data, an improved laser self-constrained adjustment method is proposed in this paper. Firstly, the laser profile that is too different from the surrounding terrain is identified as an abnormal orbit based on the slope, and the other orbits are used as references for self-constrained orbit adjustment based on the point density (the appropriate adjustment strategy is automatically selected according to the reference point density). Finally, the two types of orbit data are merged and the final adjustment is made, and then it is used as the corrected result. The results of cross point analysis show that this method can effectively correct the anomalous orbit and improve the data accuracy.

In order to give full play to the advantages of surface analysis in the study and protection of large-format painting cultural relics, a large-format hyperspectral scanning system is developed and a database of traditional pigments is established. Compared with the previous hyperspectral imaging technology for local analysis of cultural relics, the system not only improves the efficiency of analysis, but also can identify pigments and study the relative concentration distribution of the whole painting cultural relics, which can provide great help to the research of complex color mixing technology in painting. At present, the system has been used to analyze and study the Donghuamen ceiling painting in the Forbidden City, the paper painting “Buer zunzhe by Ding Guanpeng”, the silk painting “Tieluo by Shen Qinglan” and the Tangka “Auspicious Heavenly Mother Painting Buddha Statue”, and has been used to extract and enhance the information of hidden diseases of cultural relics, hidden ink stains and manuscript lines. The system is also used in the identification of pigment components and the research of mixing pigment technology. Good results have been obtained, which is of great significance to the research and protection of painting cultural relics.