[1] Tian M B, Liang T X, He W. Electronic packaging technologies and materials[J]. Semiconductor Information, 32, 42-61(1995).

[2] Zhang Z S, Lu Z Y, Chen Z W. Research progress in ceramic substrate material for electronic packaging[J]. Materials Review, 22, 16-20(2008).

[3] Zhang J L. Applications of laser processing in microelectronics packaging[J]. Printed Circuit Information, 9, 33-38(2001).

[4] Zhang S P, Zheng H Y. New progress of electronic packaging technology[J]. Electronics & Packaging, 4, 3-9(2004).

[5] Cheng H, Chen M X, Hao Z L et al. Progress of technologies and applications of ceramic substrate for the packaging of power electronics[J]. Electronic Components and Materials, 35, 7-11(2016).

[6] Cheng H, Chen M X, Luo X B et al. Ceramic substrate for electronic packaging[J]. Advanced Ceramics, 40, 265-292(2019).

[7] Hao H S, Fu P, Gong L et al. Recent achievement in research for electronic packaging ceramic substrate materials[J]. Ceramics, 24-27(2007).

[8] Li T T, Peng C Q, Wang R C et al. Research progress in ceramic substrate material for electronic packaging[J]. The Chinese Journal of Nonferrous Metals, 20, 1365-1374(2010).

[9] Mutlu M. Effects of the laser wavelength on drilling process of ceramic using Nd: YAG laser[J]. Journal of Laser Micro, 4, 84-88(2009).

[10] Samant A N, Dahotre N B. Laser machining of structural ceramics: a review[J]. Journal of the European Ceramic Society, 29, 969-993(2009).

[11] Li H F, Li J, Wen Y et al. EDM for ceramics and its research status[J]. Journal of University of Jinan (Science and Technology), 22, 178-182(2008).

[12] Thoe T B, Aspinwall D K, Wise M L H. Review on ultrasonic machining[J]. International Journal of Machine Tools and Manufacture, 38, 239-255(1998).

[13] Liu Z, Zhang H, Yan Y et al. Corrosion of sintered SiC ceramics in mixed acid solution: temperature and time dependences[J]. Corrosion Engineering, Science and Technology, 52, 38-45(2017).

[14] Ho C Y, Tsai Y H, Chen C S et al. Ablation of aluminum oxide ceramics using femtosecond laser with multiple pulses[J]. Current Applied Physics, 11, S301-S305(2011).

[15] A Z W, Wu Y, Xiao Y et al. Research progresses of process technology in ultrafast laser micro-hole drilling[J]. Chinese Journal of Lasers, 48, 0802013(2021).

[16] Zhang T Z, Zhang C, Li J et al. Formation mechanism of recast layer in millisecond laser drilling of Ti6Al4V alloys[J]. Acta Optica Sinica, 37, 0214001(2017).

[17] Zhao W Q, Mei X S, Wang W J. Ultrashort pulse laser drilling of micro-holes(part 2): experimental study[J]. Infrared and Laser Engineering, 48, 129-140(2019).

[18] Zhao W Q, Mei X S, Wang W J. Ultrashort pulse laser drilling of micro-holes(part 1): theoretical study[J]. Infrared and Laser Engineering, 48, 140-148(2019).

[19] Chen L, Liu X D, Liu J et al. Microgroove etching with femtosecond laser on quartz glass surfaces[J]. Acta Optica Sinica, 40, 2314001(2020).

[20] Kuar A S, Acherjee B, Ganguly D et al. Optimization of Nd: YAG laser parameters for microdrilling of alumina with multiquality characteristics via Grey-Taguchi method[J]. Materials and Manufacturing Processes, 27, 329-336(2012).

[21] Yan Y Z, Ji L F, Bao Y et al. Theory analysis and experiment verification on crack characters during laser processing ceramics[J]. Chinese Journal of Lasers, 35, 1401-1408(2008).

[22] Guo D, Cai K, Yang J L et al. Spatter-free laser drilling of alumina ceramics based on gelcasting technology[J]. Journal of the European Ceramic Society, 23, 1263-1267(2003).

[23] Tsai C H, Li C C. Investigation of underwater laser drilling for brittle substrates[J]. Journal of Materials Processing Technology, 209, 2838-2846(2009).

[24] Yang Z X[D]. Research on processing and application of laser drilling group-holes on alumina ceramics(2021).

[25] Sun L H[D]. The research of laser drilling on ceramics(2007).

[26] Semak V, Matsunawa A. The role of recoil pressure in energy balance during laser materials processing[J]. Journal of Physics D: Applied Physics, 30, 2541-2552(1997).

[27] Quintero F, Varas F, Pou J et al. Theoretical analysis of material removal mechanisms in pulsed laser fusion cutting of ceramics[J]. Journal of Physics D: Applied Physics, 38, 655-666(2005).

[28] Vora H D, Santhanakrishnan S, Harimkar S P et al. One-dimensional multipulse laser machining of structural alumina: evolution of surface topography[J]. The International Journal of Advanced Manufacturing Technology, 68, 69-83(2013).

[29] Mei X S, Yang Z X, Zhao W Q. Laser hole drilling on surface of electronic ceramic substrates[J]. Chinese Journal of Lasers, 47, 0500011(2020).

[30] Zhang J Y, Long Y, Liao S X et al. Effect of laser scanning speed on geometrical features of Nd: YAG laser machined holes in thin silicon nitride substrate[J]. Ceramics International, 43, 2938-2942(2017).

[31] Li G L[D]. Study on static solution assisted laser drilling(2017).

[32] Yao Y S, Chen Q B, Wang J et al. Water-jet assisted laser precision processing of Si3N4 ceramics[J]. Optics and Precision Engineering, 26, 2723-2731(2018).

[33] Kacar E, Mutlu M, Akman E et al. Characterization of the drilling alumina ceramic using Nd: YAG pulsed laser[J]. Journal of Materials Processing Technology, 209, 2008-2014(2009).

[34] Hanon M M, Akman E, Oztoprak B G et al. Experimental and theoretical investigation of the drilling of alumina ceramic using Nd: YAG pulsed laser[J]. Optics & Laser Technology, 44, 913-922(2012).

[35] Guo D, Cai K, Huang Y et al. A novel anti-spatter and anti-crack laser drilling technique: application to ceramics[J]. Applied Physics A, 76, 1121-1124(2003).

[36] Yan Y Z, Ji L F, Bao Y et al. An experimental and numerical study on laser percussion drilling of thick-section alumina[J]. Journal of Materials Processing Technology, 212, 1257-1270(2012).

[37] Adelmann B, Hellmann R. Rapid micro hole laser drilling in ceramic substrates using single mode fiber laser[J]. Journal of Materials Processing Technology, 221, 80-86(2015).

[38] Zhang S, Kang S Y. Experimental studies of laser processing of constructural ceramics[J]. Chinese Journal of Lasers, 22, 797-800(1995).

[39] Yan Y Z[D]. Investigation on laser crack-free cutting of ceramics(2013).

[40] Xiao L, Zhao J T, Yan Z F et al. Technologic investigation of laser micro-drilling on the thin ceramic plate[J]. Acta Optica Sinica, 34, s114012(2014).

[41] Chen M F, Hsiao W T, Wang M C et al. A theoretical analysis and experimental verification of a laser drilling process for a ceramic substrate[J]. The International Journal of Advanced Manufacturing Technology, 81, 1723-1732(2015).

[42] Samant A N, Dahotre N B. Computational predictions in single-dimensional laser machining of alumina[J]. International Journal of Machine Tools and Manufacture, 48, 1345-1353(2008).

[43] Samant A N, Dahotre N B. Differences in physical phenomena governing laser machining of structural ceramics[J]. Ceramics International, 35, 2093-2097(2009).

[44] Gao M, Cao K, Feng J L et al. The relation between machined surface roughness and microstructure of Al2O3 ceramics[J]. Vacuum Electronics, 44-46(2011).

[45] Lu P W, Yuan G F. Study on morphologies of Al2O3 ceramics with low-pressure water jet assisted laser drilling[J]. Applied Laser, 34, 323-326(2014).

[46] Chen C Y, Yuan G F, Wang J H. Low-pressure water jet and laser composite cutting on Al2O3 ceramic[J]. Infrared and Laser Engineering, 43, 2097-2102(2014).

[47] Xie B B, Yuan G F. Research of water jet-laser complex etching of ceramics[J]. Laser Technology, 40, 762-766(2016).

[48] Pang Z W[D]. Experiment research and numerical simulation on the low pressure jet assisted laser drilling(2014).

[49] Yao Y S, Yuan Z Z, Wang Y Y et al. Research on ultrasonic-laser machining underwater and its mechanism for silicon nitride ceramics[J]. Journal of Mechanical Engineering, 53, 207-216(2017).

[50] Bharatish A, Narasimha Murthy H N, Anand B et al. Characterization of hole circularity and heat affected zone in pulsed CO2 laser drilling of alumina ceramics[J]. Optics & Laser Technology, 53, 22-32(2013).

[51] Kuar A S, Doloi B, Bhattacharyya B. Modelling and analysis of pulsed Nd: YAG laser machining characteristics during micro-drilling of zirconia (ZrO2)[J]. International Journal of Machine Tools and Manufacture, 46, 1301-1310(2006).

[52] Xie C Y, Lu X Z, Xie H H et al. The impact of laser drilling on AlN ceramics[C], 882-885(2011).

[53] He L W[D]. Experimental study on Al₂O₃ and silicon wafer by excimer laser micromachining(2018).

[54] Luo Y, Wu X B, Zhou Y et al. Interaction between excimer laser and SiC ceramic[J]. Laser & Optoelectronics Progress, 53, 121403(2016).

[55] Chen Q[D]. Study on micro-drilling technology based on nanosecond pulsed laser(2018).

[56] Wang H J, Chen Q, Lin D T et al. Effect of scanning pitch on nanosecond laser micro-drilling of silicon nitride ceramic[J]. Ceramics International, 44, 14925-14928(2018).

[57] Nedialkov N, Sawczak M, Jendrzejewski R et al. Analysis of surface and material modifications caused by laser drilling of AlN ceramics[J]. Applied Surface Science, 254, 893-897(2007).

[58] Zhang G, Liang Y. Study on the re-cast layer for laser drilling of Al2O3 ceramics[J]. Journal of Shenyang Institute of Technology, 20, 1-4(2001).

[59] Wee L M, Khoong L E, Tan C W et al. Solvent-assisted laser drilling of silicon carbide[J]. International Journal of Applied Ceramic Technology, 8, 1263-1276(2011).

[60] Zhao W Q, Mei X S. Optimization of trepanning patterns for holes ablated using nanosecond pulse laser in Al2O3 ceramics substrate[J]. Materials, 14, 3834(2021).

[61] Chen Q, Wang H J, Lin D T et al. Characterization of hole taper in laser drilling of silicon nitride ceramic under water[J]. Ceramics International, 44, 13449-13452(2018).

[62] Wang L Z, Zhao W Q, Mei X S et al. Improving quality and machining efficiency of hole during AlN trepanning with nanosecond pulse laser[J]. Ceramics International, 46, 24018-24028(2020).

[63] Wang L Z[D]. Study on short pulse laser through-hole machining and application of ALN ceramics(2021).

[64] Zhang F, Duan J, Zeng X Y et al. UV laser microprocessing and post chemical etching on ultrathin Al2O3 ceramic substrate[J]. Journal of the European Ceramic Society, 31, 1631-1639(2011).

[65] Kaiser A, Rethfeld B, Vicanek M et al. Microscopic processes in dielectrics under irradiation by subpicosecond laser pulses[J]. Physical Review B, 61, 11437-11450(2000).

[66] Kautek W, Krüger J, Lenzner M et al. Laser ablation of dielectrics with pulse durations between 20 fs and 3 ps[J]. Applied Physics Letters, 69, 3146-3148(1996).

[67] Du K, Li X W, Yang B D et al. Research progress of femtosecond laser microhole drilling on non-metallic materials[J]. Laser & Optoelectronics Progress, 57, 111417(2020).

[68] Li X X, Jia T Q, Feng D H et al. The mechanism of ablation of sapphire by an ultra-short pulse laser[J]. Acta Physica Sinica, 53, 2154-2158(2004).

[69] Liu X, Du D, Mourou G. Laser ablation and micromachining with ultrashort laser pulses[J]. IEEE Journal of Quantum Electronics, 33, 1706-1716(1997).

[70] Min D Y, Wang X H, Dong F et al. Ultrafast laser precision drilling equipment and realization method[J]. Applied Laser, 36, 590-594(2016).

[71] Wang Y Q, Zhang J Z, Liu Y S et al. Effect of femtosecond laser parameters on TiC ceramic micro-hole drilling[J]. Chinese Journal of Lasers, 41, 1003010(2014).

[72] Kim S H, Balasubramani T, Sohn I B et al. Precision microfabrication of AlN and Al2O3 ceramics by femtosecond laser ablation[J]. Proceedings of SPIE, 6879, 68791O(2008).

[73] Stoian R, Ashkenasi D, Rosenfeld A et al. The dynamics of ion expulsion in ultrashort pulse laser sputtering of Al2O3[J]. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions With Materials and Atoms, 166/167, 682-690(2000).

[74] Ashkenasi D, Rosenfeld A, Varel H et al. Laser processing of sapphire with picosecond and sub-picosecond pulses[J]. Applied Surface Science, 120, 65-80(1997).

[75] Ashkenasi D, Stoian R, Rosenfeld A. Single and multiple ultrashort laser pulse ablation threshold of Al2O3 (corundum) at different etch phases[J]. Applied Surface Science, 154/155, 40-46(2000).

[76] Kim S H, Sohn I B, Jeong S. Ablation characteristics of aluminum oxide and nitride ceramics during femtosecond laser micromachining[J]. Applied Surface Science, 255, 9717-9720(2009).

[77] Perrie W, Rushton A, Gill M et al. Characterization of ultrafast microstructuring of alumina (Al2O3)[J]. Proceedings of SPIE, 5714, 43-52(2005).

[78] Li C D, Lee S, Nikumb S. Femtosecond laser drilling of alumina wafers[J]. Journal of Electronic Materials, 38, 2006-2012(2009).

[79] Perrie W, Rushton A, Gill M et al. Femtosecond laser micro-structuring of alumina ceramic[J]. Applied Surface Science, 248, 213-217(2005).

[80] Wang X C, Zheng H Y, Chu P L et al. Femtosecond laser drilling of alumina ceramic substrates[J]. Applied Physics A, 101, 271-278(2010).

[81] Hsu H C, Wu S J. An investigation on micro-via drilling on ceramic substrates by a picosecond laser[C], 16504416(2016).

[82] Ma Q, Zhu H, Zhang Z Y et al. An investigation into picosecond laser micro-trepanning of alumina ceramics employing a semi-water-immersed scheme[J]. Materials, 12, 1812(2019).

[83] Zhou X[D]. Study on the process and mechanism of picosecond pulse laser processing of brittle materials(2017).

[84] Zhou X, Duan J, Chen H et al. Experimental study about water-assisted laser drill on Al2O3 ceramics without recast layer[J]. Laser Technology, 42, 271-275(2018).

[85] Ren N F, Xia K B, Yang H Y et al. Water-assisted femtosecond laser drilling of alumina ceramics[J]. Ceramics International, 47, 11465-11473(2021).

[86] Wang Y Q[D]. The study of femtosecond laser processing on TiC ceramic(2014).

[87] Chien W T, Hou S C. Investigating the recast layer formed during the laser trepan drilling of Inconel 718 using the Taguchi method[J]. The International Journal of Advanced Manufacturing Technology, 33, 308-316(2007).

[88] Nasrollahi V, Penchev P, Jwad T et al. Drilling of micron-scale high aspect ratio holes with ultra-short pulsed lasers: critical effects of focusing lenses and fluence on the resulting holes’ morphology[J]. Optics and Lasers in Engineering, 110, 315-322(2018).

[89] Isselin J C, Alloncle A P, Autric M. On laser induced single bubble near a solid boundary: contribution to the understanding of erosion phenomena[J]. Journal of Applied Physics, 84, 5766-5771(1998).

[90] Kong L R, Zhang F, Duan J et al. Research of water-assisted laser etching of alumina eramics[J]. Laser Technology, 38, 330-334(2014).