Study of Femtosecond Laser Ablation and Polishing Process on RB‑SiC Surface

Huan Chen; Chaoyang Wei; Zhen Cao; Xiaocong Peng; Jianda Shao

doi:10.3788/CJL230657

Chinese Journal of Lasers, Volume. 50, Issue 24, 2402203(2023)

Study of Femtosecond Laser Ablation and Polishing Process on RB‑SiC Surface

Huan Chen^1,2, Chaoyang Wei^1,2、*, Zhen Cao^1,2、**, Xiaocong Peng^1,2, and Jianda Shao^1,2

¹Precision Optical Manufacturing and Testing Center, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China

²Center of Material Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

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Huan Chen, Chaoyang Wei, Zhen Cao, Xiaocong Peng, Jianda Shao. Study of Femtosecond Laser Ablation and Polishing Process on RB‑SiC Surface[J]. Chinese Journal of Lasers, 2023, 50(24): 2402203

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Paper Information

Category: Laser Surface Machining

Received: Mar. 28, 2023

Accepted: Jul. 12, 2023

Published Online: Oct. 24, 2023

The Author Email: Wei Chaoyang (siomwei@siom.ac.cn), Cao Zhen (caozhen@siom.ac.cn)

DOI:10.3788/CJL230657

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology