Advanced Photonics, Volume. 5, Issue 3, 036004(2023)

Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects

Jue Wang1,2、†, Chengkun Cai1,2, Feng Cui1,2, Min Yang1,2, Yize Liang1,2, and Jian Wang1,2、*
Author Affiliations
  • 1Huazhong University of Science and Technology, Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Wuhan, China
  • 2Optics Valley Laboratory, Wuhan, China
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    Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang, "Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects," Adv. Photon. 5, 036004 (2023)

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    Paper Information

    Category: Research Articles

    Received: Feb. 3, 2023

    Accepted: Apr. 13, 2023

    Posted: Apr. 14, 2023

    Published Online: May. 26, 2023

    The Author Email: Jian Wang (jwang@hust.edu.cn)

    DOI:10.1117/1.AP.5.3.036004

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