Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects

Jue Wang; Chengkun Cai; Feng Cui; Min Yang; Yize Liang; Jian Wang

doi:10.1117/1.AP.5.3.036004

Advanced Photonics, Volume. 5, Issue 3, 036004(2023)

Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects

Jue Wang^1,2、†, Chengkun Cai^1,2, Feng Cui^1,2, Min Yang^1,2, Yize Liang^1,2, and Jian Wang^1,2、*

¹Huazhong University of Science and Technology, Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Wuhan, China

²Optics Valley Laboratory, Wuhan, China

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Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang, "Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects," Adv. Photon. 5, 036004 (2023)

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Paper Information

Category: Research Articles

Received: Feb. 3, 2023

Accepted: Apr. 13, 2023

Posted: Apr. 14, 2023

Published Online: May. 26, 2023

The Author Email: Jian Wang (jwang@hust.edu.cn)

DOI:10.1117/1.AP.5.3.036004

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology