Advanced Photonics, Volume. 5, Issue 3, 036004(2023)
Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects
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Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang, "Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects," Adv. Photon. 5, 036004 (2023)
Category: Research Articles
Received: Feb. 3, 2023
Accepted: Apr. 13, 2023
Posted: Apr. 14, 2023
Published Online: May. 26, 2023
The Author Email: Jian Wang (jwang@hust.edu.cn)