Chinese Journal of Lasers, Volume. 47, Issue 8, 802010(2020)
Analysis on Tin Spattering of a Micro Solder Joint During Laser Jet Solder Ball Bonding Process
Figures & Tables(7)
Fig. 1. Schematic of bonding pad structure of right angle micro solder joint and the laser direction
Fig. 2. Micro solder joint with tin spattering and its partial enlargement. (a) Whole image of micro solder joint; (b) partially enlarged image of micro solder joint
Fig. 3. Micro solder joint with tin spattering after vacuum heat treatment and its partial enlargement. (a) Whole image of micro solder joint; (b) partially enlarged image of micro solder joint
Fig. 4. Tin spattering after CP. (a) Bonding pad after CP; (b) whole image of micro solder joint; (c) partially enlarged image of micro solder joint
Fig. 6. Forming sketch of tin spattering and gas holes in right angle solder joint
Fig. 7. Micro solder joint. (a) SEM image of solder joint with tin spattering and surfacial gas holes; (b) cross-section of another solder joint with inner gas holes
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Yue Wu, Gong Chenggong, Zhang Junxi, Bao Ying, Li Jing, Feng Yi. Analysis on Tin Spattering of a Micro Solder Joint During Laser Jet Solder Ball Bonding Process[J]. Chinese Journal of Lasers, 2020, 47(8): 802010
Paper Information
Category: laser manufacturing
Received: Feb. 17, 2020
Accepted: --
Published Online: Aug. 17, 2020
The Author Email: Yue Wu (pony.yue@163.com)
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