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Chinese Journal of Lasers, Volume. 47, Issue 8, 802010(2020)

Analysis on Tin Spattering of a Micro Solder Joint During Laser Jet Solder Ball Bonding Process

Yue Wu*, Gong Chenggong, Zhang Junxi, Bao Ying, Li Jing, and Feng Yi
Author Affiliations
  • School of Materials Engineering, Lanzhou Institute of Technology, Lanzhou, Gansu 730050, China
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    Article index updated: Mar. 10, 2025

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    Yue Wu, Gong Chenggong, Zhang Junxi, Bao Ying, Li Jing, Feng Yi. Analysis on Tin Spattering of a Micro Solder Joint During Laser Jet Solder Ball Bonding Process[J]. Chinese Journal of Lasers, 2020, 47(8): 802010

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    Paper Information

    Category: laser manufacturing

    Received: Feb. 17, 2020

    Accepted: --

    Published Online: Aug. 17, 2020

    The Author Email: Wu Yue (pony.yue@163.com)

    DOI:10.3788/CJL202047.0802010

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology