Removal Uniformity in Ring-Pendulum Double-Sided Polishing Based on Pressure Distribution

Chen Mao; Bo Xiao; Chunyang Wang; Yifan Bai; Siling Huang; Dasen Wang

doi:10.3788/AOS240703

Acta Optica Sinica, Volume. 44, Issue 16, 1622001(2024)

Removal Uniformity in Ring-Pendulum Double-Sided Polishing Based on Pressure Distribution

Chen Mao¹, Bo Xiao^2、**, Chunyang Wang^3、*, Yifan Bai², Siling Huang⁴, and Dasen Wang⁴

Author Affiliations

¹College of Weapon Science and Technology, Xi’an Technological University, Xi’an 710000, Shaanxi, China

²School of Opto-Electronical Engineering, Xi’an Technological University, Xi’an 710000, Shaanxi, China

³Xi’an Key Laboratory of Active Photoelectric Imaging Detection Technology, Xi’an Technological University, Xi’an 710000, Shaanxi, China

⁴Ningbo Branch of Chinese Academy of Ordnance Science, Ningbo 315103, Zhejiang, China

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Chen Mao, Bo Xiao, Chunyang Wang, Yifan Bai, Siling Huang, Dasen Wang. Removal Uniformity in Ring-Pendulum Double-Sided Polishing Based on Pressure Distribution[J]. Acta Optica Sinica, 2024, 44(16): 1622001

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Paper Information

Category: Optical Design and Fabrication

Received: Mar. 6, 2024

Accepted: Apr. 18, 2024

Published Online: Jul. 31, 2024

The Author Email: Bo Xiao (xiaobo@xatu.edu.cn), Chunyang Wang (wangchunyang191@163.com)

DOI:10.3788/AOS240703

CSTR:32393.14.AOS240703

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