Research on Packaging Technology of Multi‑Band Infrared Detector Assembly with Integrated Lens

Junlin Chen; Defeng Mo; Mengdie Jiang; Haiyong Zhu; Qinfei Xu; Zhijiang Zeng; Jinglin Zhang; Xiaoyang Yang; Xue Li

doi:10.3788/CJL231119

Chinese Journal of Lasers, Volume. 51, Issue 13, 1310001(2024)

Research on Packaging Technology of Multi‑Band Infrared Detector Assembly with Integrated Lens

Junlin Chen^1,2, Defeng Mo^1,2、*, Mengdie Jiang^1,2, Haiyong Zhu^1,2, Qinfei Xu^1,2, Zhijiang Zeng^1,2, Jinglin Zhang^1,2, Xiaoyang Yang^1,2, and Xue Li^1,2

Author Affiliations

¹State Key Laboratories of Transducer Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China

²Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China

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References(17)

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Junlin Chen, Defeng Mo, Mengdie Jiang, Haiyong Zhu, Qinfei Xu, Zhijiang Zeng, Jinglin Zhang, Xiaoyang Yang, Xue Li. Research on Packaging Technology of Multi‑Band Infrared Detector Assembly with Integrated Lens[J]. Chinese Journal of Lasers, 2024, 51(13): 1310001

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Paper Information

Category: remote sensing and sensor

Received: Aug. 18, 2023

Accepted: Oct. 11, 2023

Published Online: May. 14, 2024

The Author Email: Defeng Mo (dfmo@mail.sitp.ac.cn)

DOI:10.3788/CJL231119

CSTR:32183.14.CJL231119

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology