Research on Packaging Technology of Multi‑Band Infrared Detector Assembly with Integrated Lens

Junlin Chen; Defeng Mo; Mengdie Jiang; Haiyong Zhu; Qinfei Xu; Zhijiang Zeng; Jinglin Zhang; Xiaoyang Yang; Xue Li

doi:10.3788/CJL231119

Chinese Journal of Lasers, Volume. 51, Issue 13, 1310001(2024)

Research on Packaging Technology of Multi‑Band Infrared Detector Assembly with Integrated Lens

Junlin Chen^1,2, Defeng Mo^1,2、*, Mengdie Jiang^1,2, Haiyong Zhu^1,2, Qinfei Xu^1,2, Zhijiang Zeng^1,2, Jinglin Zhang^1,2, Xiaoyang Yang^1,2, and Xue Li^1,2

Author Affiliations

¹State Key Laboratories of Transducer Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China

²Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China

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Figures & Tables(12)

Fig. 1. Schematic diagram of infrared detector chip

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Fig. 2. Layout of jointing of multi-band IR detector array. (a) Vertical layout diagram of multi-band detectors; (b) schematic diagram of multi-channel detector plane layout

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Fig. 3. Schematic diagram of detector shell assembly

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Fig. 4. Overall schematic diagram of multi-band filter assembly. (a) Filter assembly structure; (b) 3D exploded view of filter assembly

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Fig. 5. Low-temperature deformation of filter

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Fig. 6. Spectral curves of infrared detector assembly. (a) 2.13-μm channel; (b) 1.64-μm channel; (c) 1.38-μm channel

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Fig. 7. Stray light analysis of module. (a) Module structure; (b) stray light for 1.365‒1.395 μm; (c) stray light for 1.615‒1.665 μm; (d) stray light for 2.105‒2.155 μm

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Fig. 8. Radiation curves of module. (a) Cold aperture radiation (radiation C) and module radiation (total radiation) versus cold aperture absorption; (b) radiation of filter holder (radiation D) and module radiation (total radiation) versus absorption of filter holder

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Fig. 9. Responsivity curves before and after reliability test

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Fig. 10. Photo of shell

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Table 1. Design results of coaxial lenses integration
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Table 1. Design results of coaxial lenses integration
Material of lens Material of blind flange Assembly method Fit clearance control /mm
SK16 4J29 Cementation fixation ±0.015

Table 2. Main performance indexes of module

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Table 2. Main performance indexes of module

Item	Value	Item	Value
Plane array structure	3×10	Noise /V	7×10^-4
Wave bands /μm	1.38 （1.365‒1.395）， 1.64 （1.615‒1.665）， 2.13 （2.105‒2.155）	Working temperature /K	130
Photosensitive element size /mm	0.300×0.260	Maximum size /mm	40×40×13
Center distance between adjacent photosensitive elements in same channel /mm	0.300±0.005	Adapter cooler	Radiation refrigeration
Band detection rate at 130 K /（ $c m \cdot H z^{1 / 2} \cdot W^{- 1}$ ）	>1.5×10¹¹	Packaging	Shell

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Junlin Chen, Defeng Mo, Mengdie Jiang, Haiyong Zhu, Qinfei Xu, Zhijiang Zeng, Jinglin Zhang, Xiaoyang Yang, Xue Li. Research on Packaging Technology of Multi‑Band Infrared Detector Assembly with Integrated Lens[J]. Chinese Journal of Lasers, 2024, 51(13): 1310001

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