Chinese Journal of Lasers, Volume. 46, Issue 10, 1001009(2019)
Thermal Stressin High-Power Semiconductor Laser Packaging
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Qinghe Yuan, Hongqi Jing, Li Zhong, Suping Liu, Xiaoyu Ma. Thermal Stressin High-Power Semiconductor Laser Packaging[J]. Chinese Journal of Lasers, 2019, 46(10): 1001009
Category: laser devices and laser physics
Received: Apr. 19, 2019
Accepted: May. 27, 2019
Published Online: Oct. 25, 2019
The Author Email: Jing Hongqi (jinghq@semi.ac.cn)