Chinese Journal of Lasers, Volume. 46, Issue 10, 1001009(2019)
Thermal Stressin High-Power Semiconductor Laser Packaging
Figures & Tables(7)
Fig. 2. Nephograms of thermal stress distribution of laser dies with different solder packages and stress distributions on central axis of end face. (a) In solder, thermal stress nephogram; (b) In solder, stress distribution on central axis of end face; (c) AuSn solder, thermal stress nephogram; (d) AuSn solder, stress distribution on central axis of end face
Fig. 3. Temperature distributions of lasers with different solder packages. (a) In solder; (b) AuSn solder
Fig. 4. Spectral distributions of lasers with different solder packages. (a) In solder; (b) AuSn solder
Fig. 5. Thermal stress and temperature maximum distribution of laser dies packaged by AuSn solders with different thicknesses
Fig. 6. Thermal stress and maximum temperature distribution of laser dies packaged by WCu submount with different thicknesses
Table 1. Related material parameters
View tableTable 1. Related material parameters
Material Density / (kg·m-3) Coefficient of thermal expansion /K-1 Thermal conductivity / (W·m-1·K-1) Poisson ratio Young's modulus /Pa Heat capacity / (J·kg-1·K-1) Melting point /℃ Cu 8900 2.4×10-5 390 0.37 1.1×1011 395 - WCu 17000 7×10-6 180 0.3 3.4×1011 750 - In 7310 3.3×10-5 81.6 0.4498 1.1×1010 230 156.61 AuSn 14700 1.6×10-5 57 0.405 6.8×1010 150 280 GaAs 5330 5.8×10-6 44 0.25 8×109 325 -
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Qinghe Yuan, Hongqi Jing, Li Zhong, Suping Liu, Xiaoyu Ma. Thermal Stressin High-Power Semiconductor Laser Packaging[J]. Chinese Journal of Lasers, 2019, 46(10): 1001009
Paper Information
Category: laser devices and laser physics
Received: Apr. 19, 2019
Accepted: May. 27, 2019
Published Online: Oct. 25, 2019
The Author Email: Jing Hongqi (jinghq@semi.ac.cn)
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