[1] Jia G N, Qiu Y T, Yan A R et al. Laser three-dimensional printing microchannel heat sink for high-power diode laser array[J]. Optical Engineering, 55, 096105(2016).

[2] Muller M S, Elsner A E. Confocal retinal imaging using a digital light projector with a near infrared VCSEL source[J]. Proceedings of SPIE, 10546, 105460G(2018).

[3] Xue Y Y, Su Z P. Freeform lens array design for precise control of irradiance distribution in VCSEL array[J]. Acta Optica Sinica, 44, 0922001(2024).

[4] Yin W, Li M Y, Hu Y et al. Speckle structured-light-based three-dimensional imaging technology and its sensor design using VCSEL projection array[J]. Laser & Optoelectronics Progress, 60, 0811014(2023).

[5] Zhou Q C, Li Y, Yuan C X et al. Failure analysis and early screening of high power substrate-transferred VCSEL arrays[J]. Chinese Journal of Lasers, 51, 1301006(2024).

[6] Xun M, Pan G Z, Zhao Z Z et al. High single fundamental-mode output power from 795 nm VCSELs with a long monolithic cavity[J]. IEEE Electron Device Letters, 44, 1144-1147(2023).

[7] Wu Z, You S D, Du Q et al. Influence of smile effect on beam properties of spectrally combined beams based on diode laser stacks[J]. Optics Communications, 471, 126031(2020).

[8] Fang J Y. Research on package structure design andthermal management technology of high power semiconductor laser[D], 40-46(2020).

[9] Yan G X, Hao Y Q, Zhang Q B. Thermal characteristics of high-power vertical cavity surface emitting laser array[J]. Acta Physica Sinica, 73, 054204(2024).

[10] Tiotsop M, Fotue A J, Kenfack S C et al. Electro-magnetic weak coupling optical polaron and temperature effect in quantum dot[J]. Journal of Semiconductors, 36, 102001(2015).

[11] Jing H Q, Zhong L, Ni Y X et al. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. Journal of Semiconductors, 36, 102006(2015).

[12] Jing H Q, Zhong L, Ni Y Q et al. Thermal analysis of high power density laser diode stack cooling structure[J]. Chinese Journal of Luminescence, 37, 81-87(2016).

[13] Zhang X L, Bo B X, Zhang Z M et al. Thermal characteristics analysis of C-mount sink package laser and optimization of heat sink structure[J]. Chinese Journal of Luminescence, 38, 891-896(2017).

[14] Wu Y Z, Liu Y, Gao Q B et al. Effect of silicon carbide transition heat sink on heat dissipation of C-mount package laser[J]. China Sciencepaper, 14, 1362-1368(2019).

[15] Fang J Y, Shi L L, Zhang H et al. Heat transfer characteristics of high power semiconductor laser with graphite sheet as auxiliary heat sink[J]. Chinese Journal of Luminescence, 40, 907-914(2019).

[16] Ma D Y, Li M, Qiu D. Research on packaging technology of transition heat sink for high power semiconductor laser[J]. Science and Technology & Innovation, 78-81(2023).

[17] Jin Z H, Sun Y F, Ning Y Q et al. High-power 980 nm vertical-cavity surface-emitting lasers[J]. Infrared and Millimeter Waves, 24, 61-64(2005).

[18] Zhang X L, Bo B X, Qiao Z L et al. Analysis of thermal characteristics based on a new type diode laser packaging structure[J]. Optical Engineering, 56, 085105(2017).

[19] Li X Y, Jiang K, Zhu Z et al. High-brightness 808 nm semiconductor laser diode packaged by SiC heat sink[J]. Journal of Modern Optics, 67, 1017-1021(2020).

[20] Xu P D, Wang B, Qian Y et al. Design and research of laminated packaging structure for semiconductor laser diode[J]. Coatings, 12, 1450(2022).

[21] Song Y Y, Zou Y G, Shi L L et al. Thermal study of vertical-cavity surface-emitting laser based on diamond heat sink[J]. Semiconductor Optoelectronics, 44, 363-370(2023).