Thermal Characteristics Analysis of Multi-Material Composite Heat Sink Structure Based on VCSEL Array

Chenxin Wang; Yonggang Zou; Jie Fan; Linlin Shi; Yuxin Yue; Yingmin Song; Hongjin Liang

doi:10.3788/LOP240999

Laser & Optoelectronics Progress, Volume. 62, Issue 3, 0316002(2025)

Thermal Characteristics Analysis of Multi-Material Composite Heat Sink Structure Based on VCSEL Array

Chenxin Wang^*, Yonggang Zou, Jie Fan, Linlin Shi, Yuxin Yue, Yingmin Song, and Hongjin Liang

State Key Laboratory of High Power Semiconductor Lasers, Changchun University of Science and Technology, Changchun 130022, Jilin , China

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Figures & Tables(9)

Fig. 1. Traditional structure schematic diagram

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Fig. 2. Temperature distribution curve diagrams of VCSEL array along different paths with different groove filling materials. (a) Path B; (b) path C

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Fig. 3. Temperature distribution curve diagrams of VCSEL array along different paths under different groove depths.(a) Path B; (b) path C

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Fig. 4. Temperature distribution curve diagrams along paths A, B, and C for devices with grooves filled with copper-diamond material underneath units 15, 16, 21, and 22

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Fig. 5. Simplified schematic diagram of novel multi-material composite heat sink

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Fig. 6. Device temperature distribution diagrams under two different heat dissipation structures. (a) Traditional structure; (b) optimized structure

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Fig. 7. Temperature distribution curves along paths A, B, and C for devices encapsulated with traditional heat dissipation structure and new heat dissipation structure

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Fig. 8. P-I characteristic curves under different thermal resistances

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Table 1. Structural and material parameters^[13-17]

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Table 1. Structural and material parameters^[13-17]

Item	Cross-section dimension /（μm×μm）	Thickness /μm	Thermal conductivity /（W/m·K）
Chip	1000×1000	120	55
Heat source	300×300	5	55
SiC	16000×16000	1000/2000	490
Square copper diamond	1000×1000	500/1000/2000	811
Cylindrical copper diamond	800×800	70/280	811
AlN	800×800	10/30/88	180
Copper	20000×20000	5000	398

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Chenxin Wang, Yonggang Zou, Jie Fan, Linlin Shi, Yuxin Yue, Yingmin Song, Hongjin Liang. Thermal Characteristics Analysis of Multi-Material Composite Heat Sink Structure Based on VCSEL Array[J]. Laser & Optoelectronics Progress, 2025, 62(3): 0316002

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