Acta Optica Sinica, Volume. 45, Issue 17, 1720010(2025)
Advances in Integration of Co‑Packaged High‑Density Optical Interconnection Chips (Invited)
[3] Liu Y, Luo Y G, Li J Y et al. Research on the application of DeepSeek in the internet of vehicles[J]. China BroadBand, 21, 158-160(2025).
[6] Sandmann S, Hegselmann S, Fujarski M et al. Benchmark evaluation of DeepSeek large language models in clinical decision-making[J]. Nature Medicine, 31, 2546-2549(2025).
[11] Li J C, Zhang W K, Dong W C et al. Progress and challenges of optical logic computation (invited)[J]. Acta Optica Sinica, 45, 1420001(2025).
[12] Sheng X, Liu H, Li L C et al. Real-time interoperability demonstration of silicon-photonics-based OSFP 800GBASE-DR8 LPO and LRO transceivers over 10km fiber transmission[C], 1098-1101(2024).
[18] Bian L Y, Zeng Y P, Cai Y et al. Opportunities and challenges of optoelectronic co-packaging technology in the era of big data[J]. Laser & Optoelectronics Progress, 61, 0900006(2024).
[21] Chen X, Mistry A, Padmaraju K et al. Segmented MZM enhanced silicon coupling-modulated ring resonator modulator operating up to 170-GBaud for coherent applications[C], 1984-1987(2024).
[44] Chen B G, Li K, Zhao Y R et al. Research progress on silicon electro-optical modulator (invited)[J]. Laser & Optoelectronics Progress, 61, 1913009(2024).
[71] Xue J T, Ma Q L, Chen S K et al. A 64 Gbaud/s hybrid integrated silicon photonic transceiver with co-designed CMOS driver and TIA for in-package optical I/O[C], 372-375(2024).
Get Citation
Copy Citation Text
Jintao Xue, Shenlei Bao, Chao Cheng, Xianglin Bu, Qian Liu, Liqun Wei, Yihao Yang, Wenfu Zhang, Binhao Wang. Advances in Integration of Co‑Packaged High‑Density Optical Interconnection Chips (Invited)[J]. Acta Optica Sinica, 2025, 45(17): 1720010
Category: Optics in Computing
Received: Jun. 15, 2025
Accepted: Aug. 19, 2025
Published Online: Sep. 3, 2025
The Author Email: Binhao Wang (wangbinhao@opt.ac.cn)
CSTR:32393.14.AOS251285