Acta Optica Sinica, Volume. 45, Issue 17, 1720010(2025)

Advances in Integration of Co‑Packaged High‑Density Optical Interconnection Chips (Invited)

Jintao Xue1,2, Shenlei Bao1,2, Chao Cheng1,2, Xianglin Bu1,2, Qian Liu1,2, Liqun Wei1,2, Yihao Yang1,2, Wenfu Zhang1,2, and Binhao Wang1,2、*
Author Affiliations
  • 1State Key Laboratory of Ultrafast Optical Science and Technology, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an 710119, Shaanxi , China
  • 2University of Chinese Academy of Sciences, Beijing 100049, China
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    Jintao Xue, Shenlei Bao, Chao Cheng, Xianglin Bu, Qian Liu, Liqun Wei, Yihao Yang, Wenfu Zhang, Binhao Wang. Advances in Integration of Co‑Packaged High‑Density Optical Interconnection Chips (Invited)[J]. Acta Optica Sinica, 2025, 45(17): 1720010

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    Paper Information

    Category: Optics in Computing

    Received: Jun. 15, 2025

    Accepted: Aug. 19, 2025

    Published Online: Sep. 3, 2025

    The Author Email: Binhao Wang (wangbinhao@opt.ac.cn)

    DOI:10.3788/AOS251285

    CSTR:32393.14.AOS251285

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