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Journal of the Chinese Ceramic Society, Volume. 53, Issue 4, 849(2025)

Application of Thermoelectric Cooling on Chip Thermal Management

LU Yao1、*, FAN Xinyue1, LUO Jie1, LIU Wenjing1, and ZHAO Lidong2
Author Affiliations
  • 1School of Microelectronics, Southern University of Science and Technology, Shenzhen 518000, Guangdong, China
  • 2School of Materials Science and Engineering, Beihang University, Beijing 100191, China
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    LU Yao, FAN Xinyue, LUO Jie, LIU Wenjing, ZHAO Lidong. Application of Thermoelectric Cooling on Chip Thermal Management[J]. Journal of the Chinese Ceramic Society, 2025, 53(4): 849

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    Paper Information

    Special Issue:

    Received: Dec. 3, 2024

    Accepted: May. 29, 2025

    Published Online: May. 29, 2025

    The Author Email: LU Yao (luy8@sustech.edu.cn)

    DOI:10.14062/j.issn.0454-5648.20240764

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology