[1] [1] P. M. Dentinger, K. L. Krafcik, K. L. Simison et al.. High aspect ratio patterning with a proximity ultraviolet source[J]. Microelectron. Engng., 2002, 61～62: 1001～1007

[5] [5] Graham Arthur, Brian Martin. Enhancing the development rate model in optical lithography simulation of ultra-thick resist films for applications such as MEMS and LIGA[C]. Proc. SPIE, 2001, 4404: 209～220

[6] [6] Tang Xionggui, Gao Fuhua, Guo Yongkang et al.. Analysis and simulation of diffractive imaging field in thick film photoresist by using angular spectrum theory[J]. Opt. Commun., 2005, 244: 123～130

[8] [8] Guo Yongkang, Tang Xionggui, Zhu Jianhua et al.. Effect of exposure intensity on the photochemical reaction speed of the lithography for thick film resists[C]. Proc. SPIE, 2005, 5878: 395～403

[11] [11] Jun Yao, Jingqin Su, Jinglei Du et al.. Coding gray-tone mask for refractive microlens fabrication[J]. Microelectron. Engng., 2000, 53: 531～534

[12] [12] V. Kudryashov , X. C. Yuan , W. C. Cheong et al.. Grey scale structures formation in SU-8 with e-beam and UV[J]. Microelectron. Engng., 2003, 67～68: 306～311

[13] [13] Yu Zhaoxian, Mo Dang. Generalized simulated annealing algorithm applied in the ellipsometric inversion problem[J]. Thin Solid Films, 2003, 425(1～2): 108～112