High Power Laser and Particle Beams, Volume. 34, Issue 6, 063004(2022)
Optimization design and simulation of electric field at interface between substrate and electrode of photoconductive switch
Figures & Tables(12)
Fig. 5. Electric field intensity of different cylindrical electrode structures
Fig. 7. Electric field intensity distribution with solder interface
Fig. 8. Maximum electric field intensity under different solder thickness
Fig. 9. Electric field distribution of dielectric constant 30 of insulating medium
Table 1. Insulation material performance
View tableView in ArticleTable 1. Insulation material performance
material dielectric strength/(kV·mm−1) dielectric constant thermal conductivity/(W·m−1·K−1) CTE/(K−1) CVD diamond 1000 5.7 1000~2000 1.1×10−6 fused silica 25~40 3.75 1.3 0.55×10−6 undoped SiC 300 10 300~500 4.0×10−6 AlN 17 9 140~180 4.5×10−6 epoxy glue 20~40 3.8~6.2 1.1 (20~60)×10−6 Al2O3 16.9 9.8 35 8.4×10−6 silicone 30~40 2.5~4 1.2 300×10−6 ZrO2 9 29 2.2 10.3×10−6
Table 2. Maximum electric field intensity of different dielectric constant insulation rings
View tableView in ArticleTable 2. Maximum electric field intensity of different dielectric constant insulation rings
material dielectric constant maximum electric field /(kV·mm−1) thickness of the solder is 0.03 mm thickness of the solder is 0.02 mm CVD diamond 5.7 39.7 36.8 Al2O3 9 37.1 32.1 undoped SiC、AlN 10 34.4 27.6 CdWO4 12.8 32.3 28.9 MnWO4 15 30.4 27.3 ZnWO4 17.6 27.7 26.1 CoNb2O6 20 27.2 25.7 Ba5Ta4O15 26 24.0 24.1 ZrO2 30 24.8 22.0 ZrO2 32 24.2 23.5
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Yan Luo, Lei Ding, Yi Zhao, Chongbin Yao, Lichun Wang. Optimization design and simulation of electric field at interface between substrate and electrode of photoconductive switch[J]. High Power Laser and Particle Beams, 2022, 34(6): 063004
Paper Information
Category: High Power Microwave Technology
Received: Aug. 20, 2021
Accepted: Jan. 24, 2022
Published Online: Jun. 2, 2022
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