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Piezoelectrics & Acoustooptics, Volume. 47, Issue 1, 108(2025)

Research on a Rapid Verification Method for RF System-in-Package Module Links

CUI Mengqi1...2, YU Huaiqiang1,2, ZHANG Lei2, WANG Xi2 and DAI Chunyue2 |Show fewer author(s)
Author Affiliations
  • 1CETC Academy of Chips Technology, Chongqing 401332, China
  • 2The 26th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, China
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    [1] [1] BAI Mingqiang, YANG Guanghua, ZAHNG Decai, et al. Design of a frequency conversion front end based on SIP[C]∥Chengdu, China: 2024 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), 2024.

    [2] [2] LU Xilong, ZHOU Shigang, WEI Bin, et al. Three-dimensional SIP design of the four-channel RF transceiver based on silicon and AlN for X-band radar applications[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(7): 1030-1044.

    [7] [7] MIAO Min, ZHANG Danya, NIE Xin, et al. A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging[J]. Microelectronics Journal, 2022, 129: 105582.

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    CUI Mengqi, YU Huaiqiang, ZHANG Lei, WANG Xi, DAI Chunyue. Research on a Rapid Verification Method for RF System-in-Package Module Links[J]. Piezoelectrics & Acoustooptics, 2025, 47(1): 108

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    Paper Information

    Received: Jan. 20, 2025

    Accepted: Apr. 17, 2025

    Published Online: Apr. 17, 2025

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2025.01.018

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology