Piezoelectrics & Acoustooptics, Volume. 47, Issue 1, 108(2025)

Research on a Rapid Verification Method for RF System-in-Package Module Links

CUI Mengqi1...2, YU Huaiqiang1,2, ZHANG Lei2, WANG Xi2 and DAI Chunyue2 |Show fewer author(s)
Author Affiliations
  • 1CETC Academy of Chips Technology, Chongqing 401332, China
  • 2The 26th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, China
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    CUI Mengqi, YU Huaiqiang, ZHANG Lei, WANG Xi, DAI Chunyue. Research on a Rapid Verification Method for RF System-in-Package Module Links[J]. Piezoelectrics & Acoustooptics, 2025, 47(1): 108

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    Paper Information

    Received: Jan. 20, 2025

    Accepted: Apr. 17, 2025

    Published Online: Apr. 17, 2025

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2025.01.018

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