Piezoelectrics & Acoustooptics, Volume. 47, Issue 1, 108(2025)
Research on a Rapid Verification Method for RF System-in-Package Module Links
To tackle the issues of long design cycles, high costs, and poor compatibility in radiofrequency (RF) system-in-package (SiP) modules, this paper presents a fast verification method for RF SiP module links. RF devices in the module are separately packed into different building blocks. These blocks are then assembled to form a verification link with the desired circuit functions. By testing this link, we can quickly check if the RF SiP module design meets the requirements. A high-frequency connection bridge crimping structure is designed for good inter-block connection. Test results, after de-embedding calculation, showed that within 18 GHz, the maximum insertion loss value was 1.34 dB. Building and testing the verification link of a dual-conversion RF SiP module demonstrated that the proposed method had low loss along with reconfigurable and reusable features. The rapid design of RF SiP modules is of great engineering importance.
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CUI Mengqi, YU Huaiqiang, ZHANG Lei, WANG Xi, DAI Chunyue. Research on a Rapid Verification Method for RF System-in-Package Module Links[J]. Piezoelectrics & Acoustooptics, 2025, 47(1): 108
Received: Jan. 20, 2025
Accepted: Apr. 17, 2025
Published Online: Apr. 17, 2025
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