Piezoelectrics & Acoustooptics, Volume. 47, Issue 1, 108(2025)

Research on a Rapid Verification Method for RF System-in-Package Module Links

CUI Mengqi1...2, YU Huaiqiang1,2, ZHANG Lei2, WANG Xi2 and DAI Chunyue2 |Show fewer author(s)
Author Affiliations
  • 1CETC Academy of Chips Technology, Chongqing 401332, China
  • 2The 26th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, China
  • show less

    To tackle the issues of long design cycles, high costs, and poor compatibility in radiofrequency (RF) system-in-package (SiP) modules, this paper presents a fast verification method for RF SiP module links. RF devices in the module are separately packed into different building blocks. These blocks are then assembled to form a verification link with the desired circuit functions. By testing this link, we can quickly check if the RF SiP module design meets the requirements. A high-frequency connection bridge crimping structure is designed for good inter-block connection. Test results, after de-embedding calculation, showed that within 18 GHz, the maximum insertion loss value was 1.34 dB. Building and testing the verification link of a dual-conversion RF SiP module demonstrated that the proposed method had low loss along with reconfigurable and reusable features. The rapid design of RF SiP modules is of great engineering importance.

    Tools

    Get Citation

    Copy Citation Text

    CUI Mengqi, YU Huaiqiang, ZHANG Lei, WANG Xi, DAI Chunyue. Research on a Rapid Verification Method for RF System-in-Package Module Links[J]. Piezoelectrics & Acoustooptics, 2025, 47(1): 108

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Received: Jan. 20, 2025

    Accepted: Apr. 17, 2025

    Published Online: Apr. 17, 2025

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2025.01.018

    Topics