[1] [1] TEH P L, JAAFAR M, AKIL H M, et al. Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application ［J］. Polymers for Advanced Technologies, 2008, 19(4): 308-315.

[3] [3] KIM J H, UMEHARA N, KOUSAKA H, et al. Effect of micro-sacle Young's modulus and surface roughness on adhesion property to plasma-treated rubber surface ［J］. Journal of Machanical Science and Technology, 2010, 24(1): 119-122.

[6] [6] TAN N X, LIM K H H, BOURDILLON A J. Analysis of coatings which inhibit epoxy bleeding in electronic packaging ［J］. Journal of Materials Science: Materials in Electronics,1997, 8(2): 73-77.

[12] [12] ZHOU H R, SUN A, YANG H C, et al. Research on performance of epoxy electronic packaging materials ［J］. Advanced Materials Research, 2013, 668: 226-230.