Microelectronics, Volume. 53, Issue 5, 938(2023)
Research on the Mechanism of Silica-Gel Cracking on the Side Wall of Nickel Plated Metallic Package
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CHEN Rong, XIAO Ling, LU Ke1, LUO Chi, LIAO Xiyi, HU Yanbin, ZHANG Ying, CUI Wei. Research on the Mechanism of Silica-Gel Cracking on the Side Wall of Nickel Plated Metallic Package[J]. Microelectronics, 2023, 53(5): 938
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Received: Oct. 9, 2022
Accepted: --
Published Online: Jan. 3, 2024
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