Microelectronics, Volume. 53, Issue 5, 938(2023)

Research on the Mechanism of Silica-Gel Cracking on the Side Wall of Nickel Plated Metallic Package

CHEN Rong1, XIAO Ling2, LU Ke11, LUO Chi2, LIAO Xiyi2, HU Yanbin2, ZHANG Ying2, and CUI Wei1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    Silica gel has cracking phenomena on the side wall of nickel-plated tube shell, which mainly includes glue dot cracking during the first adhesion processing, cracking after a single cleaning, cracking after random vibration in reliability experiment, etc. Those cracking issues will further lead to a series of reliability problems such as connection failure. In this paper, the theoretical calculation of the ultimate destructive force of bonding, the simulation calculation of adhesive with different dot diameters and different spacing adhesives, and the surface energy improvement caused by plasma cleaning were carried out in view of the cracking problem of Ni-plated shell sidewall reinforcement of type A silica gel. The results show that optimizing the bonding structure of the wire-glue module and cleaning of the nickel-plated shell with plasma can significantly improve the reliability of the sidewall bonding of type A silica gel on the sidewall of the nickel-plated shell. The relevant research results can be used in the actual production practice of A type silica gel.


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    CHEN Rong, XIAO Ling, LU Ke1, LUO Chi, LIAO Xiyi, HU Yanbin, ZHANG Ying, CUI Wei. Research on the Mechanism of Silica-Gel Cracking on the Side Wall of Nickel Plated Metallic Package[J]. Microelectronics, 2023, 53(5): 938

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    Paper Information


    Received: Oct. 9, 2022

    Accepted: --

    Published Online: Jan. 3, 2024

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