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Piezoelectrics & Acoustooptics, Volume. 47, Issue 3, 520(2025)

Wafer-Level Packaging-Surface Acoustic Wave Process Based on Silicon Caps

SHU Ping1, MI Jia1, LEI Kai1, LIANG Liuhong1, LIN Canghai2, LENG Junlin1, and CHEN Xing1
Author Affiliations
  • 1The 26th Institute of China Electronics Technology Group Corporation，Chongqing 400060，China
  • 2Xiamen Sky Semiconductor Technology Co. Ltd.，Xiamen 361026，China
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    SHU Ping, MI Jia, LEI Kai, LIANG Liuhong, LIN Canghai, LENG Junlin, CHEN Xing. Wafer-Level Packaging-Surface Acoustic Wave Process Based on Silicon Caps[J]. Piezoelectrics & Acoustooptics, 2025, 47(3): 520

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    Received: Jan. 12, 2025

    Accepted: --

    Published Online: Jul. 11, 2025

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2025.03.018

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology