On-Chip Integrated Multi-Dimensional Optical Interconnects and Optical Processing

Jian Wang; Xiaoping Cao; Xinliang Zhang

doi:10.3788/CJL202148.1206001

Chinese Journal of Lasers, Volume. 48, Issue 12, 1206001(2021)

On-Chip Integrated Multi-Dimensional Optical Interconnects and Optical Processing

Jian Wang^*, Xiaoping Cao, and Xinliang Zhang^**

Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, Hubei 430074, China

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Jian Wang, Xiaoping Cao, Xinliang Zhang. On-Chip Integrated Multi-Dimensional Optical Interconnects and Optical Processing[J]. Chinese Journal of Lasers, 2021, 48(12): 1206001

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Paper Information

Category: fiber optics and optical communications

Received: Mar. 1, 2021

Accepted: Apr. 13, 2021

Published Online: Jun. 7, 2021

The Author Email: Wang Jian (jwang@hust.edu.cn), Zhang Xinliang (xlzhang@hust.edu.cn)

DOI:10.3788/CJL202148.1206001

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology