Fig. 1. Crystal properties and applications of the third-generation semiconductor materials^［1］

Fig. 2. Main variables affecting laser processing^[36]

Fig. 3. Comparison between two polishing technologies^［40］. (a) Long-pulse laser thermal polishing; (b) short-pulse laser cold polishing

Fig. 4. Surface morphologies of the 6H-SiC before and after laser polishing^[44]

Fig. 5. SiC surfaces irradiated by 5 pulse with different wavelengths^[53]. (a) 515 nm; (b) 1030 nm

Fig. 6. MRR and surface roughness after polishing of single crystal SiC using different methods in previous studies^{[26-27,34,52,61,66]}

Fig. 7. Schematic illustration of underwater femtosecond laser polishing processing^[71]

Fig. 8. LIMJAA technology^［33］. (a) Schematic of LIMJAA process; (b) photograph of laser-induced microjet

Fig. 9. Concept of the hybrid CO₂ laser-polishing process^[34]. (a) Laser machining; (b) mechanical polishing; (c) laser-assisted polishing

Fig. 10. Material removal mechanism of hybrid laser-assisted polishing process^[34]