Acta Optica Sinica, Volume. 45, Issue 16, 1612001(2025)

Optimized Characterization Model of Curvature Radius-Stress for Wafer Thin Films

Xiaodong Zhang, Zhiguo Han, Lin Zhao, Jiahuan Zhang, Xiaoqing Xu, Suoyin Li, and Aihua Wu*
Author Affiliations
  • The 13th Institute of CETC, Shijiazhuang 050051, Hebei , China
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    References(15)

    [8] Gao C X. Study of the distribution and control of stress in optical thin films[D], 14-35(2015).

    [10] Zhao M J. Mechanical analysis of substrate bending deformation caused by film stress[J]. Ordnance Material Science and Engineering, 37, 76-79(2014).

    [11] Wang R J, Han Y, Yu S Y. On-chip semiconductor lasers for silicon photonics (invited)[J]. Acta Optica Sinica, 44, 1513010(2024).

    [15] Chen L, Liu H, Liu Z Q et al. Optical property test and imaging performance analysis of Fresnel liquid crystal lens[J]. Laser & Optoelectronics Progress, 62, 1611004(2025).

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    Xiaodong Zhang, Zhiguo Han, Lin Zhao, Jiahuan Zhang, Xiaoqing Xu, Suoyin Li, Aihua Wu. Optimized Characterization Model of Curvature Radius-Stress for Wafer Thin Films[J]. Acta Optica Sinica, 2025, 45(16): 1612001

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    Paper Information

    Category: Instrumentation, Measurement and Metrology

    Received: Apr. 16, 2025

    Accepted: May. 21, 2025

    Published Online: Aug. 18, 2025

    The Author Email: Aihua Wu (wuaihua@cetc13.cn)

    DOI:10.3788/AOS250950

    CSTR:32393.14.AOS250950

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