Development of Integrated Passive Devices Based on Through Glass Via Interconnect Technology

LIU Xiaoxian; LIAO Lihang; ZHU Zhangming

doi:10.16257/j.cnki.1681-1070.2025.0149

Electronics and Packaging, Volume. 25, Issue 7, 70104(2025)

Development of Integrated Passive Devices Based on Through Glass Via Interconnect Technology

LIU Xiaoxian, LIAO Lihang, and ZHU Zhangming^*

Key Laboratory of Analog Integrated Circuits and Systems, Ministry of Education, School of Integrated Circuits, Xidian University, Xi'an 710071, China

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LIU Xiaoxian, LIAO Lihang, ZHU Zhangming. Development of Integrated Passive Devices Based on Through Glass Via Interconnect Technology[J]. Electronics and Packaging, 2025, 25(7): 70104

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Paper Information

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Received: Mar. 25, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: ZHU Zhangming (zmyh@263.net)

DOI:10.16257/j.cnki.1681-1070.2025.0149

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