Fig. 1. Diagram of collision cascade classification. (a) Single collision regime; (b) linear collision process; (c) nonlinear collision process

Fig. 2. Flow chart of program algorithm for linear collision theory

Fig. 3. Distribution of sputtering yield under different energies and incident angles. (a) 0°; (b) 45°; (c) 85°

Fig. 4. Distribution of sputtering yield under different incident angles

Fig. 5. Change of damage depth under different energies and incident angles. (a) 0°; (b) 45°; (c) 85°

Fig. 6. Impact region of collision cascade at different incident angles

Fig. 7. Longitudinal distribution of damage density

Fig. 8. Longitudinal distributions of energy loss of different ions. (a) He⁺; (b) Ne⁺; (c) Ar⁺

Fig. 9. Effect of Ar ion on sputtering of Si/SiO₂/Cu/Au. (a) Sputtering yield; (b) damage depth

Fig. 10. Effect of Ga ion on sputtering of Si/SiO₂/Cu/Au. (a) Sputtering yield; (b) damage depth