Microelectronics, Volume. 52, Issue 3, 510(2022)
Study on the Au-Si Diffusion Mechanism in AuSn Alloy Welding Process of Silicon-Based Chips
[1] [1] WEISS S, BADER V, AZDASHT G. Fluxless die bonding of high power laser bars using AuSn-metallurgy [J]. IEEE Proceed Elec Compon & Technol Conf. San Jose, CA, USA. 1997: 780-787.
[2] [2] TOLLEFSEN T A, LARSSON A,LOVVIK O M,et al. Au-Sn SLID bonding-properties and possibilities [J]. Metallurgical and Materials Trans B, 2012, 43B:397-405.
[11] [11] COFFA S,JACOBSON D C,POATE J M, et al. Mechanisms of ion-beam-enhanced diffusion in amorphous silicon [J]. Appl Phys A, 1992, 54(6):481-484.
[12] [12] MONSON T K, VECHTEN J V,GRAUPNER R K. Comment on "Gold, self-, and dopant diffusion in silicon" [J]. Phys Rev B Conden Matter, 1994, 49(4): 2972-2976.
[13] [13] COFFA S,PRIVITERA V,FRISINA F,et al. Three‐dimensional concentration profiles of hybrid diffusers in crystalline silicon [J]. J Appl Phys, 1993, 74(1): 195-200.
Get Citation
Copy Citation Text
JIANG Kai, ZHU Hongjiao, LI Jing long, WANG Xuguang, TAN Kankan. Study on the Au-Si Diffusion Mechanism in AuSn Alloy Welding Process of Silicon-Based Chips[J]. Microelectronics, 2022, 52(3): 510
Category:
Received: Dec. 9, 2021
Accepted: --
Published Online: Jan. 18, 2023
The Author Email: