Microelectronics, Volume. 52, Issue 3, 510(2022)
Study on the Au-Si Diffusion Mechanism in AuSn Alloy Welding Process of Silicon-Based Chips
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JIANG Kai, ZHU Hongjiao, LI Jing long, WANG Xuguang, TAN Kankan. Study on the Au-Si Diffusion Mechanism in AuSn Alloy Welding Process of Silicon-Based Chips[J]. Microelectronics, 2022, 52(3): 510
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Received: Dec. 9, 2021
Accepted: --
Published Online: Jan. 18, 2023
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