Based on the excimer laser ablation principle, etching technique for achieving optical waveguide end face is proposed for application requirements of optical printed circuit backplane interconnect. With the laser etching technique, optical coupling end face can be fabricated at any position on optical printed circuit backplane. An excimer laser with the wavelength of 193 nm is used as the ablation light source. The laser beam is projected onto the optical waveguide for etching through a square aperture mask. The relationship among the laser energy, laser pulse times and etching depth, surface roughness has been studied experimentally. After optimizing the etching parameters, the coupling loss increase of the waveguide end face is approximate 1.3 dB after the etching process.