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Laser & Infrared, Volume. 55, Issue 6, 905(2025)

Research on infrared focal plane chip flip-chip interconnect process inspection and application

OUYANG Tian, LIU Ming, FENG Xiao-yu, and NING Ti
Author Affiliations
  • The 11th Research Institute of CETC, Beijing 100015, China
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    [7] [7] Tarjan R E, Zwick U. Finding strong components using depth-first search[J]. European Journal of Combinatorics, 2024, 119: 103815.

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    OUYANG Tian, LIU Ming, FENG Xiao-yu, NING Ti. Research on infrared focal plane chip flip-chip interconnect process inspection and application[J]. Laser & Infrared, 2025, 55(6): 905

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    Paper Information

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    Received: Aug. 9, 2024

    Accepted: Jul. 30, 2025

    Published Online: Jul. 30, 2025

    The Author Email:

    DOI:10.3969/j.issn.1001-5078.2025.06.011

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology