Infrared focal plane chips primarily consist of infrared focal plane arrays and readout integrated circuits, with flip-chip interconnection technology serving as the critical supporting technique in their manufacturing process. By introducing electrical testing to the chips after flip-chip bonding, it can provide an effective means of monitoring the interconnection quality. To meet the requirements of rapid and efficient detection of flip-chip process, a batch automatic testing method for chip interconnection connectivity is developed, realizing automatic identification of defective interconnections in test result images. Additionally, this detection method is applied after subsequent processes such as glue filling and backside thinning, with test results enabling monitoring of the influence of subsequent processes after flip-chip. The research presented in this paper satisfies the demand for improved testing efficiency while offering solutions for pinpointing process issues.