High Power Laser and Particle Beams, Volume. 36, Issue 2, 025019(2024)
High speed package-on-package structure designed for SiC-MOSFET and its performance evaluation
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Jiuxin Ma, Jianhao Ma, Lüheng Ren, Liang Yu, Chenguo Yao, Shoulong Dong. High speed package-on-package structure designed for SiC-MOSFET and its performance evaluation[J]. High Power Laser and Particle Beams, 2024, 36(2): 025019
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Received: Jul. 9, 2023
Accepted: Oct. 25, 2023
Published Online: Mar. 21, 2024
The Author Email: Liang Yu (yu_liang@cqu.edu.cn)