High Power Laser and Particle Beams, Volume. 36, Issue 2, 025019(2024)
High speed package-on-package structure designed for SiC-MOSFET and its performance evaluation
Fig. 1. Schematic diagram of the interior of the package-on-package (PoP) structure
Fig. 3. Spatial variation of magnetic field of laminated package during pulse formation
Fig. 4. Magnetic density vector distribution of the PoP structure in pulse flat top stage
Fig. 5. Current density distribution of the PoP structure in pulse flat top stage
Fig. 6. Schematic diagram of switching characteristic test circuit
Fig. 8. Comparison of double pulse test waveforms at rated current 36 A between TO-263 and PoP switches
Fig. 9. Comparison of double pulse test waveforms when the pulse current is 90 A between TO-263 and PoP switches
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Jiuxin Ma, Jianhao Ma, Lüheng Ren, Liang Yu, Chenguo Yao, Shoulong Dong. High speed package-on-package structure designed for SiC-MOSFET and its performance evaluation[J]. High Power Laser and Particle Beams, 2024, 36(2): 025019
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Received: Jul. 9, 2023
Accepted: Oct. 25, 2023
Published Online: Mar. 21, 2024
The Author Email: Liang Yu (yu_liang@cqu.edu.cn)