High Power Laser and Particle Beams, Volume. 35, Issue 11, 111005(2023)

Improving laser damage resistance of fused silica by organic fluoric acid etching

Fangting Chi, Xiaoyu Li, Yuanli Li, Lina Lü, Hao Peng, and Zhiyuan Du
Author Affiliations
  • Innovation Center for Nuclear Environmental Safety, Southwest University of Science and Technology, Mianyang 621010, China
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    The laser damage resistance of fused silica optics is of great significance for the stable operation of high-power laser systems. To improve the laser damage resistance of fused silica optics, and to solve the problem of deposition formed by traditional hydrofluoric acid etching, a method based on organic fluoric acid etching is developed. The advantage of organic fluoric acid etching is that the etching product has good solubility, thus reducing the possibility of forming deposition. Organic fluoric acid solution was used for static etching of fused silica optics, and the surface quality, transmittance, and laser damage density of the opticss were characterized and analyzed. The results of surface quality and transmittance show that the fused silica optics after organic fluoric acid etching have less deposition and impurity, indicating that the organic fluoric acid etching is effective in preventing the formation of deposition. The laser damage tests show that the fused silica optics after 6 μm etching have the average laser damage density of 0.26 cm-2, which is close to those treated by advanced mitigation process (AMP2). Organic fluoric acid based etching for improving the laser damage resistance of fused silica optics has opened up a new pathway in enhancing laser loading capacity.

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    Fangting Chi, Xiaoyu Li, Yuanli Li, Lina Lü, Hao Peng, Zhiyuan Du. Improving laser damage resistance of fused silica by organic fluoric acid etching[J]. High Power Laser and Particle Beams, 2023, 35(11): 111005

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    Paper Information

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    Received: May. 14, 2023

    Accepted: Sep. 27, 2023

    Published Online: Dec. 26, 2023

    The Author Email:

    DOI:10.11884/HPLPB202335.230131

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