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Semiconductor Optoelectronics, Volume. 46, Issue 3, 484(2025)

Study on Abrasive-Assisted Laser-Electrochemical Hybrid Machining of Through-Silicon Vias

ZHANG Wenjie, MAO Dongchen, and ZHU Hao
Author Affiliations
  • School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, CHN
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    ZHANG Wenjie, MAO Dongchen, ZHU Hao. Study on Abrasive-Assisted Laser-Electrochemical Hybrid Machining of Through-Silicon Vias[J]. Semiconductor Optoelectronics, 2025, 46(3): 484

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    Paper Information

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    Received: Apr. 8, 2025

    Accepted: Sep. 18, 2025

    Published Online: Sep. 18, 2025

    The Author Email:

    DOI:10.16818/j.issn1001-5868.20250408002

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology