Chinese Optics Letters, Volume. 22, Issue 12, 120001(2024)
High-density MDM-WDM silicon photonic transmitter chiplet based on MRMs and dual-mode GC for 4 × 56 Gbps 3D co-packaged optical interconnects On the Cover
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Xinyi Wang, Jiangbing Du, Weihong Shen, Ke Xu, Zuyuan He, "High-density MDM-WDM silicon photonic transmitter chiplet based on MRMs and dual-mode GC for 4 × 56 Gbps 3D co-packaged optical interconnects," Chin. Opt. Lett. 22, 120001 (2024)
Special Issue: SPECIAL ISSUE ON OPTICAL INTERCONNECT AND INTEGRATED PHOTONIC CHIP TECHNOLOGIES FOR HYPER-SCALE COMPUTING SYSTEMS
Received: May. 25, 2024
Accepted: Sep. 9, 2024
Published Online: Jan. 2, 2025
The Author Email: Jiangbing Du (dujiangbing@sjtu.edu.cn)