Chinese Optics Letters, Volume. 22, Issue 12, 120001(2024)

High-density MDM-WDM silicon photonic transmitter chiplet based on MRMs and dual-mode GC for 4 × 56 Gbps 3D co-packaged optical interconnects On the Cover

Xinyi Wang1, Jiangbing Du1、*, Weihong Shen2, Ke Xu3, and Zuyuan He1
Author Affiliations
  • 1State Key Laboratory of Advanced Optical Communication Systems and Networks, Shanghai Jiao Tong University, Shanghai 200240, China
  • 2Institute of Photonic Chips, University of Shanghai for Science and Technology, Shanghai 200093, China
  • 3Department of Electronic and Information Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
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    References(27)

    [10] E. Timurdogan, Z. Su, R.-J. Shiue et al. 400G silicon photonics integrated circuit transceiver chipsets for CPO, OBO, and pluggable modules. Optical Fiber Communication Conference, T3H(2020).

    [16] Y. Xu, J. Lin, R. Dubé-Demers et al. A single-laser flexible-grid WDM silicon photonic transmitter using microring modulators. Optical Fiber Communication Conference, W1I(2018).

    [17] J. Fujikata, M. Noguchi, S.-H. Jeong et al. High-speed and 16 λ-WDM operation of Ge/Si electro-absorption modulator for C-band spectral regime. Optical Fiber Communications Conference and Exhibition (OFC), 1(2020).

    [18] D. Kong, H. Xin, K. Kim et al. 300 Gb/s net-rate intra-datacenter interconnects with a silicon integrated optical frequency comb modulator. Optical Fiber Communications Conference and Exhibition (OFC), 1(2020).

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    Xinyi Wang, Jiangbing Du, Weihong Shen, Ke Xu, Zuyuan He, "High-density MDM-WDM silicon photonic transmitter chiplet based on MRMs and dual-mode GC for 4 × 56 Gbps 3D co-packaged optical interconnects," Chin. Opt. Lett. 22, 120001 (2024)

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    Paper Information

    Special Issue: SPECIAL ISSUE ON OPTICAL INTERCONNECT AND INTEGRATED PHOTONIC CHIP TECHNOLOGIES FOR HYPER-SCALE COMPUTING SYSTEMS

    Received: May. 25, 2024

    Accepted: Sep. 9, 2024

    Published Online: Jan. 2, 2025

    The Author Email: Jiangbing Du (dujiangbing@sjtu.edu.cn)

    DOI:10.3788/COL202422.120001

    CSTR:32184.14.COL202422.120001

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