High-density MDM-WDM silicon photonic transmitter chiplet based on MRMs and dual-mode GC for 4 × 56 Gbps 3D co-packaged optical interconnects

Xinyi Wang; Jiangbing Du; Weihong Shen; Ke Xu; Zuyuan He

doi:10.3788/COL202422.120001

Chinese Optics Letters, Volume. 22, Issue 12, 120001(2024)

High-density MDM-WDM silicon photonic transmitter chiplet based on MRMs and dual-mode GC for 4 × 56 Gbps 3D co-packaged optical interconnects On the Cover

Xinyi Wang¹, Jiangbing Du^1、*, Weihong Shen², Ke Xu³, and Zuyuan He¹

Author Affiliations

¹State Key Laboratory of Advanced Optical Communication Systems and Networks, Shanghai Jiao Tong University, Shanghai 200240, China

²Institute of Photonic Chips, University of Shanghai for Science and Technology, Shanghai 200093, China

³Department of Electronic and Information Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China

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Xinyi Wang, Jiangbing Du, Weihong Shen, Ke Xu, Zuyuan He, "High-density MDM-WDM silicon photonic transmitter chiplet based on MRMs and dual-mode GC for 4 × 56 Gbps 3D co-packaged optical interconnects," Chin. Opt. Lett. 22, 120001 (2024)

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Paper Information

Special Issue: SPECIAL ISSUE ON OPTICAL INTERCONNECT AND INTEGRATED PHOTONIC CHIP TECHNOLOGIES FOR HYPER-SCALE COMPUTING SYSTEMS

Received: May. 25, 2024

Accepted: Sep. 9, 2024

Published Online: Jan. 2, 2025

The Author Email: Jiangbing Du (dujiangbing@sjtu.edu.cn)

DOI:10.3788/COL202422.120001

CSTR:32184.14.COL202422.120001

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