Electronics and Packaging, Volume. 25, Issue 7, 70106(2025)
Research Status of Through Glass Via Technology and Its Reliability
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MA Bingxu, WANG Haozhong, ZHONG Xiangxiang, XIANG Junshan, LIU Peijiang, ZHOU Bin, YANG Xiaofeng. Research Status of Through Glass Via Technology and Its Reliability[J]. Electronics and Packaging, 2025, 25(7): 70106
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Received: Mar. 31, 2025
Accepted: Aug. 26, 2025
Published Online: Aug. 26, 2025
The Author Email: YANG Xiaofeng (yxf004@hotmail.com)