Electronics and Packaging, Volume. 25, Issue 7, 70106(2025)

Research Status of Through Glass Via Technology and Its Reliability

MA Bingxu1, WANG Haozhong1,2, ZHONG Xiangxiang1,2, XIANG Junshan3, LIU Peijiang1, ZHOU Bin1, and YANG Xiaofeng1、*
Author Affiliations
  • 1China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511330, China
  • 2School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China
  • 3China Electronics Technology Group Corporation No.24 Research Institute, Chongqing 400030, China
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    MA Bingxu, WANG Haozhong, ZHONG Xiangxiang, XIANG Junshan, LIU Peijiang, ZHOU Bin, YANG Xiaofeng. Research Status of Through Glass Via Technology and Its Reliability[J]. Electronics and Packaging, 2025, 25(7): 70106

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    Paper Information

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    Received: Mar. 31, 2025

    Accepted: Aug. 26, 2025

    Published Online: Aug. 26, 2025

    The Author Email: YANG Xiaofeng (yxf004@hotmail.com)

    DOI:10.16257/j.cnki.1681-1070.2025.0157

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