Research Status of Through Glass Via Technology and Its Reliability

MA Bingxu; WANG Haozhong; ZHONG Xiangxiang; XIANG Junshan; LIU Peijiang; ZHOU Bin; YANG Xiaofeng

doi:10.16257/j.cnki.1681-1070.2025.0157

Electronics and Packaging, Volume. 25, Issue 7, 70106(2025)

Research Status of Through Glass Via Technology and Its Reliability

MA Bingxu¹, WANG Haozhong^1,2, ZHONG Xiangxiang^1,2, XIANG Junshan³, LIU Peijiang¹, ZHOU Bin¹, and YANG Xiaofeng^1、*

Author Affiliations

¹China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511330, China

²School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China

³China Electronics Technology Group Corporation No.24 Research Institute, Chongqing 400030, China

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MA Bingxu, WANG Haozhong, ZHONG Xiangxiang, XIANG Junshan, LIU Peijiang, ZHOU Bin, YANG Xiaofeng. Research Status of Through Glass Via Technology and Its Reliability[J]. Electronics and Packaging, 2025, 25(7): 70106

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Paper Information

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Received: Mar. 31, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: YANG Xiaofeng (yxf004@hotmail.com)

DOI:10.16257/j.cnki.1681-1070.2025.0157

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