Chinese Journal of Lasers, Volume. 49, Issue 2, 0202018(2022)

Algorithm and Experiment of Silicon Wafer Multifocus Laser Stealth Dicing

Huaizhi Zhang, Jiaming Xu, Lantian Zhang, and Yingxiong Qin*
Author Affiliations
  • School of Optical and Electronic Information, Huazhong University of Science and Technology, National Engineering Research for Laser Processing, Wuhan, Hubei 430074, China
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    Figures & Tables(8)
    Schematic of multi-focus distribution under large numerical aperture
    Nonlinear mapping diagram
    Flow chart of iterative loop for solving objective function
    Simulation results of equivalent energy three-focus with axial focus interval of 80 μm. (a) Phase hologram;(b) axial intensity distribution
    Simulation results of equivalent energy five-focus with axial focus interval of 160 μm. (a) Phase hologram; (b) axial intensity distribution
    Simulation results of five-focus with axial focus interval of 160 μm and energy ratio of 1∶2∶3∶2∶1. (a) Phase hologram; (b) axial intensity distribution
    Schematic of experimental multi-focus stealth dicing setup
    Cross-section of wafers after cutting
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    Huaizhi Zhang, Jiaming Xu, Lantian Zhang, Yingxiong Qin. Algorithm and Experiment of Silicon Wafer Multifocus Laser Stealth Dicing[J]. Chinese Journal of Lasers, 2022, 49(2): 0202018

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    Paper Information

    Category: laser manufacturing

    Received: Jun. 28, 2021

    Accepted: Aug. 9, 2021

    Published Online: Jan. 11, 2022

    The Author Email: Qin Yingxiong (qyx@hust.edu.cn)

    DOI:10.3788/CJL202249.0202018

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