Infrared Technology, Volume. 47, Issue 5, 571(2025)
Bonding of Ceramic Substrate and CMOS Chip of EBAPS Devices
References(3)
[7] [7] Barbier R, Cajgfinger T, Calabria P, et al. A single-photon sensitive EBCMOS camera: The LUSIPHER prototype[J].Nuclear Instruments and Methods in Physics Research A, 2011,648: 266-274.
[8] [8] WANG Wei, LI Ye, SONG De, et al. Research on chip thinning technology[C]//Proc. SPIE, SixthSymposium on Novel Optoelectronic Detection Technology and Applications, 2020: 114556S, doi: 10.1117/12.2565288.
[10] [10] Andreas Larsson, Torleif A Tollefsen, Ole Martin Lovik, et al. A review of eutectic Au-Ge solder joints[J].Metallurgical And Materials Transactions A, 2019, https://doi.org/10.1007/s11661-019-05356-0.
Tools
Get Citation
Copy Citation Text
TAN Hesheng, CHEN Mingxin, ZHAO Heng, WANG Lingyan, YANG Wenbo, DENG Huabing, JIN Yingkun, FENG Yunxiang, DAO Lichun, ZHANG Kunlin. Bonding of Ceramic Substrate and CMOS Chip of EBAPS Devices[J]. Infrared Technology, 2025, 47(5): 571
Paper Information
© Copyright 2018-2021 | Chinese Laser Press.
All Rights Reserved 沪ICP备15018463号-20